Double side PVA Clean(双面刷洗机)
Double Side Final Clean (最終清洗機)
- Wafer Device(器件)
6/8/12"Double side Etching/Clean
(双面蝕刻/清洗机)
- Backside Process(背面製程)
- After
Thinning Etching/Clean
(減薄後蝕刻/清洗机) - Other Application(其它應用)
After CMP Substrate(Glass/Quartz….)
Clean

設備軟体模塊
Platform Features
•Optical
Reference Table Deck Construction- Chambers, Robot and WIP all set to same
reference point in 3 dimensions. Control of stacked tolerances.
•Teach-less
Positioning- teach 1 position, the rest are fixed.
•Improved
Lift/Rotate- 2/3 fewer parts.
•Lighter
robot - amplifiers moved off-board, faster operation, and better
serviceability.
•Improved
Flow and Monitoring- distributed flow system with flow meters on all critical
process flows.
•Reduced
Chemical Consumption- improved chemical management returns more chemical to
reclaim.
Design Criteria
•Interchangeable - Exchange parts quickly and
without adjustment.
•Precise - No adjustments necessary, pinned in
place, control of stacked tolerances. •Repeatable - Moving parts return to same position
each time.
•Less
Expensive - Reduce the cost for consumables and
maintenance.
•Robust - Fewer points of failure, fewer moving
parts.
•Tighter
process controls -
Less variation in process fluid flow rates, temperatures, spin speed.