產品分類


產品分類 

設備硬体模塊

1.DSB: Double Side Brush Module
2.HPS: High pressure spray cleaning module
3.WIM: Wafer Immersion module
4.DSC : Double-sided process module
5.TWP: Thinning Wafer Processing Module
6.CDS: Chemical Supply Module
7.RPM: Robot Platform module

設備軟体模塊

Platform Features
•Optical Reference Table Deck Construction- Chambers, Robot and WIP all set to same reference point in 3 dimensions. Control of stacked tolerances.
•Teach-less Positioning- teach 1 position, the rest are fixed.
•Improved Lift/Rotate- 2/3 fewer parts.
•Lighter robot - amplifiers moved off-board, faster operation, and better serviceability. •Improved Flow and Monitoring- distributed flow system with flow meters on all critical process flows.
•Reduced Chemical Consumption- improved chemical management returns more chemical to reclaim.

Design Criteria
•Interchangeable - Exchange parts quickly and without adjustment.
•Precise - No adjustments necessary, pinned in place, control of stacked tolerances. •Repeatable - Moving parts return to same position each time.
•Less Expensive - Reduce the cost for consumables and maintenance.
•Robust - Fewer points of failure, fewer moving parts.
•Tighter process controls - Less variation in process fluid flow rates, temperatures, spin speed.