• Substrate(晶片)/ EPI (外延)

• Double side PVA Clean(双面刷洗机) 
  

• Double Side Final Clean (最終清洗機) 
  

• Wafer Device(器件) 
  

• 6/8/12"Double side Etching/Clean
  (双面蝕刻/清洗机)

• Backside Process(背面製程)
• After Thinning Etching/Clean
  (減薄後蝕刻/清洗机)
• Other Application(其它應用)

• After CMP Substrate(Glass/Quartz….)
  Clean

Wafer Backside Process(背面製程)

Application:

(1) Metal and Particle Removal after Backside Grinding/Polish

(2) Wafer double side Clean after Wafer De-Bond.

Substrate: Silicon/GaN/SiC